CCAM

Connected, Cooperative and Automated Mobility

CDR

Carbon dioxide removal

CFD

Computational fluid dynamics

CMOS

Complementary metal–oxide–semiconductor

cMUT

Capacitive micromachined ultrasound transducer

CNN

Convolutional neural network

CNT

Carbon nanotube

CrMMC

Carbon-reinforced metal matrix composites

CT

Computed tomography

CVD

Chemical vapour deposition

D2D

Device-to-device

DCS

Distributed control systems

DfA

Design for assembly

DfM

Design for manufacturing

DfR

Design for reliability

DfX

Design for excellence

DL

Deep learning

DNN

Deep neural network

DRAM

Dynamic random access memory

DSA

Directed self-assembly

DSL

Domain-specific language

DSS

Decision-support system

DT

Drug-targeted

DUV

Deep ultraviolet

E/E

Electrical/electronic

EC-RAM

Error correction RAM

ECPS

Embedded and cyber-physical system

ECS

Electronic components and systems

ECSO

European Cyber Security Organisation

ECU

Electronic control unit

EDA

Electronic design automation

EFFRA

European Factories of the Future Research Association

eHPC

Embedded high-performance computing

EHR

Electronic health record

EIP-AGRI

European Innovation Partnership “Agricultural Productivity and Sustainability”

EMC

Electromagnetic compatibility

EMI

Electromagnetic interference

EMR

Electronic medical record

EMS

Energy management systems

eNVM

Embedded non-volatile memory

EOL

End-of-life

EP

Engineering process

EPI

European Processor Initiative

ERP

Enterprise resource planning

ERTRAC

European Road Transport Research Advisory Council

ESAAF

European Space Agency Architecture Framework

ESS

Electronic smart system

ETP

European Technology Platform

ETP4HPC

European Technology Platform for High Performance Computing

EU

European Union

EUV

Extreme ultraviolet

EV

Electric vehicle

FAIR

Facebook AI Research

FAIRness

Findability, accessibility, interoperability and reuse

FCC

Federal Communications Commission

FDSOI

Fully depleted SOI

Fe

Ferroelectric

FEM

Finite element method

FEOL

Front end of line

FET

Future and emerging technologies

FFT

Fast Fourier transform

FinFet

Fin field-effect transistor

FLOPS

(flops or flop/s) Floating point operations per second

FMEA

Failure mode and effect analysis

FMI

Functional mock-up interface

FMIS

Farm management information system

fMRI

Functional magnetic resonance imaging

FMU

Functional mock-up unit

FPGA

Field-programmable gate array

GAFAM

Google, Apple, Facebook, Amazon and Microsoft

GaN

Gallium nitride

GDPR

GHG

Greenhouse gas

GPS

Global Positioning System

GPU

Graphics processing unit

HAD

Highly automated driving

HCI

Human–computer interaction

HEMT

High-electron-mobility transistor

HEV

Hybrid electric vehicle

HF

High-frequency

HIL

Hardware-in-the-loop

HIR

Heterogeneous Integration Roadmap

HMI

Human–machine interface

HMLV

High mix low volume

HPC

High-performance computing

HTA

Hexagon Tensor Accelerator

HVAC

Heating, ventilation and air conditioning

HVDC

High-voltage direct current

HW

Hardware

I/O

Input/output

IC

Integrated chip

IC

Integrated circuit

ICT

Information and communications technology

IDM

Integrated device manufacturer

IEA

International Energy Agency

IGBT

Insulated-gate bipolar transistor

IIA

Industrial Internet Architecture

IIoT

Industrial IoT

IIRA

Industrial Internet Reference Architecture

INCOSE

International Council on Systems Engineering

iNEMI

International Electronics Manufacturing Initiative

IoMT

Internet of Medical Things

IoT

Internet of Things

IP

Intellectual property

IP

Internet protocol

IPCEI

Important project of common European interest

IPM

Integrated pest management

IPSR

Integrated Photonic Systems Roadmap

Infrared

IT

information technology

IVD

in vitro diagnostic

LV

Low voltage

M2M

Machine-to-machine

MaaS

Manufacturing as a service

MaaS

Mobility-as-a-service

MCM

Multi-chip module

MCU

Microcontroller unit

MDM

Multi-dimensional metrology

MEC

Multi-access edge computing

MEC

Mobile edge computing

Medtech

Medical technology

MEMS

Micro-electromechanical systems

MES

Manufacturing execution system

MES

Multi-energy system

MIL

Model-in-the-loop

ML

Machine learning

MM-ENS

Multimodal energy system

MNBS

Micro-nano-bio system

MNS

Micro-nanosystems

MODAF

Ministry of Defence Architecture Framework (UK)

MOEMS

Micro-opto-electro-mechanical system

MOF

Metal–organic framework

MOOC

Massive open online course

MPU

Microprocessing unit

OCT

Optical coherence tomography

ODD

Operational design domain

OECD

Organisation for Economic Co-operation and Development

OEM

Original equipment manufacturer

OOC

Organ-on-a-chip

OSI

open systems interconnection

OSS

Operations support system

OT

Operational technology

OTA

Over-the-air

OXRAM

Oxide-based RAM

P2P

Peer-to-peer

P4

Predictive, preventive, personalised, participatory

PAD

Productivity-aware design

PCB

Printed circuit board

PCM

Phase-change memory

PCRAM

Phase-change RAM

PDMS

Polydimethylsiloxane

PEALD

Plasma-enhanced atomic layer deposition

PFI

Physical and functional integration

PGHD

Patient-generated health data

PHM

Prognostic health management

PIII

Plasma-immersion ion implantation

Pl

Polyimide

PLC

Programmable logic controllers

PLM

Product lifestyle management

PMIC

Power management integrated circuit

PMUT

Piezoelectric micromachined ultrasound transducer

PoC

Point-of-care

PoCT

Point-of-care testing

PoF

Physics of failure

PPAC

Power, performance, area and cost

PPE

Personal protective equipment

qZSI

Quasi-impedence source inverter

R&D

Research and development

R&D&I

Research and development and innovation

RAM

Random-access memory

RAMI 4.0

Reference Architecture Model for Industry 4.0

ReRAM

Resistive RAM

RES

Renewable energy system

RF

Radio frequency

RFID

Radio-frequency identification

RL

Reinforcement learning

RNN

Recursive neural network

ROHS

Restriction of Hazardous Substances Directive

ROI

Return on investment

RPA

Robotic process automation

RRAM

Resistive RAM

RT-PCR

Real-time reverse transcription polymerase chain reaction

RTE

Run-time environment

RTO

Research and technology organisation

RUL

Remaining useful life

SaaS

Software as a service

SAC

Conventional SnAgCu

SAC

Tin-silver-copper alloy (SnAgCu)

SAE

Society of Automotive Engineers

SDK

Software development kit

SDN

Software-defined networking

SDR

Software-defined radio

SEAP

Strategic Environmental Assessment Plan

SECAP

Sustainable Energy and Climate Action Plan

SEES

Self-powered electrochemical energy storage system

SGD

Speech-generating device

SiC

Silicon carbide

SIL

Software-in-the-loop

SiP

System in a package

SKC

Skills, knowledge and competence

SME

Small and medium-sized enterprise

SoA

Service-oriented architecture

SoC

System on a chip

SoCPS

System of cyber-physical systems

SOI

Silicon-on-insulator

SoS

System of Systems

SOT

Spin-orbit torque

SOTIF

Safety of Intended Functionality

SPIRE

Sustainable Process Industry through Resource and Energy Efficiency

SRAM

Static RAM

SRGM

Software reliability growth models

SRIA

Strategic Research and Innovation Agenda

SSI

Smart systems integration

STDP

Spike-timing-dependent plasticity

STEM

Science, technology, engineering and mathematics

STT

Spin-transfer torque

SUMP

Sustainable Urban Mobility Plan

SUT

System-under-test

SW

Software

SWM

Smart Water Management

TCP

Transmission control protocol

TEV

Through-encapsulant via

Tera operations per second

TOU

Time of use