Contributors | ECS SRIA

List of Contributors

Chairman
Paolo	Azzoni	Eurotech, Inside-IA	IT
Vice-Chairs
Patrick	Cogez	AENEAS Office	FR
Nicolas	Gouze	EPoSS Office	DE
Members
Christophe	Wyon	CEA	FR
Wolfgang	Dettmann	Infineon	DE
Jürgen	Niehaus	SafeTRANS	DE
Jerker	Delsing	Lulea University of Technology	SE
Patrick	Pype	NXP	BE
Sven	Rzepka	Fraunhofer ENAS	DE
Arco	Krijgsman	ASML	NL

Leaders
Paolo	Azzoni	Eurotech, Inside-IA	IT
Patrick	Cogez	AENEAS Office	FR
Nicolas	Gouze	EPoSS Office	DE
Christophe	Wyon	CEA	FR
Wolfgang	Dettmann	Infineon	DE
Jürgen	Niehaus	SafeTRANS	DE
Jerker	Delsing	Lulea University of Technology	SE
Patrick	Pype	NXP	BE
Sven	Rzepka	Fraunhofer ENAS	DE
Arco	Krijgsman	ASML	NL

CHAPTER 1.1 – PROCESS TECHNOLOGY, EQUIPMENT, MATERIALS AND SEMICONDUCTOR MANUFACTURING

Leaders
Jo	De Boeck	IMEC	BE
Arco	Krijgsman	ASML	NL
Gerhard	Döll	Carl Zeiss	DE
Christophe	Wyon	CEA	FR
Dominique	Thomas	STMicroelectronics	FR
Christophe	Figuet	Soitec	FR
Christian	Meyne	Infineon	DE
Contibutors
Mohand	Achouche	III-V Lab	FR
Ton	Backx	Technical University of Eindhoven	NL
Roel	Baets	University of Gent	BE
Livio	Baldi	ENI2	IT
Francis	Balestra	IMEP	FR
Markus	Bender	Advanced Mask Technology Center	DE
Jérôme	Bourderionnet	Thales Research and Technology	FR
François	Brunier	SOITEC	FR
Wolfgang	Buchholtz	GlobalFoundries	DE
Heinz	Cramer	LAM Research - AU	AU
Robin	de Bruijn	Philips Innovation Services	NL
Frank	de Jong	FEI	NL
Stefan	de Gendt	IMEC	BE
Wolfgang	Dettmann	Infineon Technologies	DE
Gerhard	Domann	FhG ISC	DE
Marc	Duranton	CEA	FR
Ilan	Englard	Applied Materials	NL
Thomas	Fleischmann	Bosch	DE
Luis	Fonseca	IMB-CNM (CSIC)	ES
Mart	Graef	TU Delft	NL
Soenke	Habenicht	Nexperia	DE
Paul	Heremans	Imec	BE
Michael	Heuken	AIXTRON	DE
Olaf	Kievit	TNO	NL
Jochen	Kinauer	camLine	DE
Anton	Koeck	Materials Center Leoben	AT
Herman	Leenders	Technical University of Eindhoven	NL
Arne	Leinse	LioniX	NL
Smuel	Mironi	NOVA	IL
Reinhard	Neul	Robert Bosch	DE
George	Nikolakopoulos	Luleå University of Technology	SE
Cian	O’Murchu	Tyndall National Institute	IRL
Lothar	Pfitzner	Friedrich-Alexander-Universität	DE
Anneliese	Poenninger	EV Group	AT
Klaus	Pressel	Infineon Technologies	DE
Pekka	Pursula	VTT	FI
Carlo	Reita	CEA	FR
Kari	Ronka	Flexbright	FI
Laurent	Roux	Ion Beam Services	FR
Martin	Schellenberger	Fraunhofer-Gesellschaft	DE
Michael	Scholles	Fraunhofer-Gesellschaft	DE
Robert	Schreutelkamp	Applied Materials	BE
Georg	Schwalb	Siltronic	DE
Pietro	Siciliano	IMM-CNR	IT
Hessel	Sprey	ASM	BE
Anne	Van den Bosch	IMEC	BE
Rogier	Verberk	TNO	NL
Andre	Verweij	BESI	NL
Philippe	Vialletelle	STMicroelectronics	FR
Marco	Gavagnin	AT&S	AT
Sven	Rzepka	Fraunhofer-Gesellschaft	DE
Christophe	Wyon	CEA-Leti	FR

CHAPTER 1.2 – COMPONENTS, MODULES AND SYSTEMS INTEGRATION

Leaders
Pekka	Pursula	VTT Technical Research Centre of Finland, Ltd.	FI
Luis	Fonseca	IMB-CNM (CSIC)	ES
Matthias	Kuehnel	Robert Bosch GmbH	DE
Michael	Scholles	Fraunhofer IPMS	DE
Nicholas	Gouze	VDI / VDE	DE
Contibutors
Reinhard	Neul	Robert Bosch GmbH	DE
Michael	Hayes	Tyndall	IE
Paolo	Azzoni	Eurotech, Inside-IA	IT
Alberto	Sillitti	Centre for Applied Software Engineering	IT
Marco	Cavagnin	AT&S AG	AT
Sven	Rzepka	Fraunhofer ENAS	DE
Maik	Wiemer	Fraunhofer ENAS	DE
Frank	Roscher	Fraunhofer ENAS	DE
Timo	Aalto	VTT Technical Research Centre of Finland, Ltd.	FI
Jukka	Hast	VTT Technical Research Centre of Finland, Ltd.	FI
Manfred	Dietrich	Dikuli	DE

CHAPTER 1.3 – EMBEDDED SOFTWARE AND BEYOND

Leaders
Frank	van der Linden	Philips	NL
Ronald	Begeer	TNO	NL
Peter	Priller	AVL	AT
Jasmin	Jahić	University of Cambridge	GB
Contibutors
Paolo	Azzoni	Eurotech, Inside-IA	IT
Frans	Beenker	TNO	NL
Gael	Blondelle	Eclipse	FR
Jerker	Delsing	Lulea University of Technology	SE
G	Demir	Akimetal	TR
Marc	Duranton	CEA	FR
Luis Lino	Ferreira	ISEP	PT
Joost	Gabriels	Eindhoven University of Technology	NL
Lenka	Koskova	TUL	CZ
Philippe	Krief	Eclipse	DE
Wouter	Leibbrandt	TNO	NL
Jan	Lohstroh	INSIDE-IA	NL
Harm	Munk	TNO	NL
Jurgen	Niehaus	SafeTRANS	DE
Antti	Niemela	Lapimnamk	FI
Olov	Schelen	OPERAX	SE
Michael	Siegel	OFFIS	DE
Ad	ten Berg	NXP Semiconductors, INSIDE-IA	NL
Peter	van Otterlo	Eindhoven University of Technology	NL
Marco	Jahn	Eclipse	DE
Daniela	Cancila	CEA	FR
Carlo	Cavazzoni	Leonardo	IT
Alberto	Bianchi	Leonardo	IT

CHAPTER 1.4 – SYSTEM OF SYSTEMS

Leaders
Paolo	Azzoni	Eurotech, Inside-IA	IT
Jerker	Delsing	Lulea University of Technology	SE
Contibutors
Ronald	Begeer	TNO	NL
Armando	Colombo	University of Applied Sciences Emden/Leer	DE
Harm	Munk	TNO	NL
Marina	Settembre	Fondazione Ugo Bordoni	IT
Leibbrandt	Wouter	TNO	NL
Stefan	Jakubek	TU Wien	AT
Christoph	Hametner	TU Wien	AT
Gianluigi	Ferrari	University of Parma	IT
Alberto	Bianchi	Leonardo	IT
Charles	Robinson	Thales	NL

CHAPTER 2.1 – EDGE COMPUTING AND EMBEDDED ARTIFICIAL INTELLIGENCE

Leaders
Marc	Duranton	CEA	FR
Ferdinand	Bell	NXP	DE
Pascal	Ribot	STMicroeleectronics	FR
Holger	Schmidt	Infineon Technologies AG	DE
Contibutors
Paolo	Azzoni	Eurotech, Inside-IA	IT
Martin	Cech	University of West Bohemia	CZ
Francesco	Conti	Università di Bologna	IT
Luca	Benini	Università di Bologna	IT
Bjorn	Debaillie	IMEC	BE
Mario	Diaz Nava	STMicroelectronics	FR
Christophe	Figuet	Soitec	FR
Stefan	Jakubek	Tu Wien	AT
Nicolas	Lehment	NXP	DE
Dirk	Mayer	Fraunhofer	DE
Francesco	Pessolano	Xetal	BE
Inessa	Seifert	Vdi/Vde	DE
Gerd	Teepe	T3 Technologies	DE
Massimo	Vecchio	FBK	IT
Ovidiu	Vermesan	Sintef	NO

CHAPTER 2.2 CONNECTIVITY

Leaders
Jerker	Delsing	Lulea University of Technology	SE
Fred	Giansello	ST	FR
Didier	Belot	CEA	FR
Contibutors
Alexandros	Kaloxylos	5G Infrastructure Association	GR
Christophe	Figuet	SOITEC	FR
Fredrik	Tillman	Ericsson	SE
Piet	Wambacq	IMEC	BE
Mohand	Achouche	Nokia	FI
Aamo	Pärsinen	Oulu University	FI
Yaning	Zou	TU Dresden	DE

CHAPTER 2.3 ARCHITECTURE AND DESIGN: METHODS AND TOOLS

Leaders
Albrecht	Donat	Siemens	DE
Jürgen	Niehaus	SafeTRANS	DE
Horst	Pfluegl	AVL	AT
Ralf	Popp	edacentrum	DE
Contributors
Livio	Baldi	--	IT
Alberto	Bianchi	Leonardo Group	IT
Andre	Bolles	OFFIS	DE
Daniela	Cancilia	CEA	FR
Patrick	Cogez	AENEAS	FR
Manfred	Dietrich	DiKuLi	DE
Marc	Duranton	CEA	FR
Fahad	Golra	Agileo Automation	FR
Przemyslaw Jakub	Gromala	Robert Bosch	DE
Romano	Hoofman	IMEC	BE
Jasmin	Jahic	Uni Cambridge	GB
Sytze	Kalisvaart	TNO	NL
Philippe	Krief	Ecplise Foundation	--
Laura	Lezzerini	MBDA	IT
Nadja	Marko	Virtual Vehicle	AT
Frank	Oppenheimer	OFFIS	DE
Luigi	Pomante	UNIVAQ	IT
Peter	Priller	AVL	AT
Pablo	Sanchez	TEISA UNICAN	ES
Holger	Schmidt	Infineon Technologies	DE
Herbert	Taucher	Siemens	DE
Martin	Törngren	KTH	SE
Frank	Van den Linden	Philips	NL

CHAPTER 2.3 QUALITY, RELIABILITY, SAFETY AND CYBERSECURITY

Leaders
Przemyslaw	Gromala	Robert Bosch GmbH	DE
Sven	Rzepka	Fraunhofer ENAS	DE
Joachim	Hillebrand	Virtual Vehicle Research GmbH	AT
Daniela	Cancila	CEA	FR
Peter	Moertl	Virtual Vehicle Research GmbH	AT
Contributors
Cristina	De Luca	Silicon Austria Labs	AT
Martin	Niessner	Infineon	DE
Christopf	Schmittner	Austrian Institute of Technology	AT
Marcello	Coppola	ST Microelectronics	FR
Haydn	Thompson	THHINK Wireless Technologies Ltd	UK
Markus	Tauber	Research Studios Austria (RSA)	AT
Martin	Törngren	KTH	SE
Dimitrios	Serpanos	University of Patras	GR
Paolo	Azzoni	Eurotech, Inside-IA	IT
Fons	DeMey	Uni. Antwerpen	BE
Atefe	Dalirsani	Robert Bosch GmbH	DE
Olli	Venta	VTT	FI
Jerker	Delsing	LTU	SE
Claudio	Pastrone	Links Foundation	IT
Bentley	Oakes	Uni Antwerpen	BE
Marina	Settembre	Fondazione Ugo Bordoni	IT
Willem	van Driel	Signify	NL
Ovidiu	Vermesan	Sintef	NO
Marc	Duranton	CEA	FR
Lukasz	Kulas	Politechnika Gdanska	PL
Valentina	Palazzi	Unipg	IT
Bart	Vandevelde	IMEC	BE
Bo	Eriksson	Ericsson	SE
Elena	Tsiporkova	Sirris	BE
Daniel	Vanderstraeten	OnSemi	BE
Ugur	Yayan	İnovasyon Mühendislik Ltd.	TR
Kashi Vishwanath	Machani	Globalfoundries	DE
Dirk	Breuer	Globalfoundries	DE
Dag	Andersson	RiSe	SE
Klas	Brinkfeldt	RiSe	SE
Per-Erik	Tegehall	RiSe	SE
Wolfgang	Wondrak	Daimler	DE
Jonas	Arwindson	Saab Group	SE
Klaus	Pressel	Infineon	DE
Sylvie	Wuidart	STMicroelectronics	FR
Alberto	Bianchi	Leonardo	IT
Jasmin	Jahic	Queens’ College, Cambridge	UK
Fabio	Martinelli	Consiglio Nazionale delle Ricerche	IT
Luis Miguel	Pinho	ISEP, Polytechnic Institute of Porto	PT

CHAPTER 3.1 MOBILITY

Leaders
Jochen	Langheim	STMicroelectronics	FR
Gereon	Meyer	VDI / VDE	DE
Michael	Paulweber	AVL List GmbH	AT
Patrick	Pype	NXP Semiconductors	BE
Daniel	Watzenig	VIF	AT
Contributors
Nicola	Amati	Politecno di Torino	IT
Remi	Bastien	Renault	FR
Kucie	Beaumel	EGVIA	BE
Thilo	Bein	FRAUNHOFER	DE
Andre	Blum	Audi	DE
Dominique	Bolignano	Prove&Run	DE
Jean-Luc	Brossard	PFA	FR
Alberto	Coen	STMicroelectronics	FR
Fredrik	Dahlgren	Ericsson	SE
Werner	Damm	OFFIS	DE
Wolfgang	Dettmann	Infineon Technologies	DE
Andreas	Eckel	TTTech	AT
Roch	Elkhoury	Vedecom	FR
Francois	Fischer	ERTICO	BE
Thomas	Fleischmann	Robert Bosch	DE
Carla	Gohin	MPSA	FR
Riccardo	Groppo	IDEAS & MOTION	IT
Manfred	Harrer	ASFINAG	AT
Berthold	Hellenthal	Audi	DE
Arnaud	Jaffuel	Faurecia	FR
Stefan	Jakubek	TU Wien	AT
Reiner	John	Infineon Technologies	DE
Dominique	Laousse	SNCF	FR
Herman	Leenders	Eindhoven University of Technology	NL
Dave	Marples	Technolution	UK
Chris	Merveille	IKERLAN	ES
Andreas	Middendorf	Fraunhofer IZM	DE
Herve	Mokrani	Airbus DS SLC	FR
Prasant	Narula	APTIV	DE
Patrick	Nebout	Faurecia	FR
Jurgen	Niehaus	SafeTRANS e.V.	DE
Markus	Pistauer	CISC	AT
Sven	Rzepka	Fraunhofer	DE
Patrick	Sega	Valeo	FR

CHAPTER 3.2 ENERGY

Leaders
Wolfgang	Dettmann	Infineon Technologies AG	DE
Antonio	Imbruglia	STMicroelectronics	IT
Thomas	Hammer	Siemens AG	DE
Contributors
Michele	Albano	Aalborg University	DK
Angelo	Bonfitto	Politecnico di Torino	It
Thierry	Bouchet	CEA LETI	FR
Thomas	Ernst	CEA LETI	FR
Luis	Fonseca	CNM CSIC	ES
Albert	Frank	Silicon Austria Labs	AT
Francesco	Gennaro	STMicroelectronics	IT
Xavier	Jordà	CNM CSIC	ES
Cox	Mark	TU Eindhoven	NL
Trajkovic	Marija	TU Eindoven	NL
Sergio	Martinez-Navas	LEITAT	ES
Paul	Merkus	TU Eindhoven	NL
Chris	Merveille	Ikerlan	ES
Michael	Metzger	Siemens	DE
Michael	Ostling	KTH	SE
harald	Poetter	FhG IZM	DE
Pertti	Raatikainen	VTT	FI
Ville	Rauhala	Lapinamk	FI
Sven	Rzepka	FhG ENAS	DE
Michael	Salter	RISE	SE
Johannes	Stöckl	AIT	AT
Andrea	Tonoli	Politecnico di Torino	IT
Pavel	Vaclavek	CEITEC	CZ
Stefan	Wolf	VDI VDE IT	DE

CHAPTER 3.3 DIGITAL INDUSTRY

Leaders
Alberto	Bianchi	Leonardo S.p.A.	IT
Olli	Venta	Consultant	FI
Antonio	Lionetto	STM-IT	IT
Mikka	Karaila	Valmet Automation	FI
Contributors
Delsing	Jerker	LTU	SE
Garcia	Carlos	IMR	ES
Yazici	Ahmet	Eskisehir Osmangazi Univ.	TR
Rogo	Francesco	Leonardo S.p.A.	IT
Vallirinne	Jani	Oulu University	FI
Olga	Kattan	Philips

CHAPTER 3.4 HEALTH AND WELLBEING

Leaders
Olivier	Horbowy	ST	FR
Michael	Scholles	FhG IPMS / MEOS	DE
Roger	van Galen	Philips	NL
Contibutors
Mario	Baum	FhG ENAS	DE
Ronald	Begeer	TNO	NL
Ronald	Dekker	Philips	NL
Marc	Desmulliez	School of Engineering & Physical Sciences	UK
Peter	Detemple	FhG IMM	DE
Wolfgang	Eberle	IMEC	BE
Helio	Fernandez Tellez	IMEC	BE
Cesar	Fernandez-Sanchez	CSIC IMB-CNM	ES
Ignacio	Garcia	Soros Gabinete	ES
Nicolas	Gouze	VDI/ VDE-IT	DE
Piotr	Grabiec	Institute of Electron Technology	PL
Radu	Grosu	TU Wien	AT
Rainer	Günzler	Hahn-Schickard	DE
Christian	Hedayat	FhG ENAS	DE
Stephan	Karmann	Hahn-Schickard	DE
Lenka	Lhotska	CVUT	CZ
Eila	Linna	Lapin AMK	FI
Marc	Masa	LEITAT	ES
Paul	Merkus	TU Eindhoven	NL
Carmen	Moldovan	IMT	RO
Eric	Moore	Tyndall	IE
Sotir	Ouzounov	Philips	NL
Peter	Ramm	FhG EMFT	DE
Pietro	Siciliano	IMM-CNR	IT
Gerd	Teepe	T3 Technologies	NL
Tatiana	Trantidou	ITML	GR
Maurits	van der Heiden	TNO	NL
Mark	van Helvoort	Philips	NL
Carmen	van Vilsteren	TU Eindhoven	NL
Andrea	Vitaletti	Wsense	IT
Andreas	Vogl	SINTEF	NO
Roberto	Zafalon	ST	IT
Silvia	Zinetti	Inpeco	IT

CHAPTER 3.5 AGRIFOOD AND NATURAL RESOURCES

Leaders
Mario	Diaz Nava	STMicroelectronics (Chair)	FR
Cian	Ó Murchú	Tyndall (Co-Chair)	IE
Contributors
Joaquin	Bastos	Instituto de Telecomunicações	PT
Thilo	Bein	Fraunhofer	DE
Jamila	Boudaden	Fraunhofer	DE
Sywert	Brongersma	Imec-NL	NL
Carles	Cane Ballart	IMB-CNM (CSIC)	ES
Ricardo	Coppel	Hydrao	FR
Roberto	Fresco	CREA-IT	IT
Rafael	Ferrer	Hispatec	ES
Laura	Lopéz	Hispatec	ES
Christian	Germain	Agro-Bordeaux	FR
Guillaume	Le Paud	Teagasc	IE
Herman	Leenders	TUE	NL
Suzanne	Lesecq	CEA (leti)	FR
Pierre	Lovera	Tyndall	IE
Mike	Morrissey	Analog Devices	IE
Luis	Munoz	Universidad de Cantabria	ES
Louise	Burgoyne	Tyndall	IE
Alan	O’Riordan	Tyndall	IE
Luis	Perez-Freire	Gradiant/AIOTI WG Smart framing	ES
Peter	Ramm	Fraunhofer	DE
Olivier	Sommier	Ertus	FR
Philippe	Stoop	Itk	FR
Ricardo	Vazquez Perez	Emalcsa	ES
Ovidiu	Vermesan	Sintef	NO
Gwenaelle	Berthier	IRT-Systemx	FR
Markus	Tauber	RSA FG	AT
Miguel	Roncale	Alphasip	ES

CHAPTER 3.6 DIGITAL SOCIETY

Leaders
Paul	Merkus	TU/e	NL
Charly	Bastiaansen	TU/e	NL
Francesco	Pessolano	Xetal	IT
Contributors
Klaas-Jan	Damstra	Grass Valley	NL
Nuria	De Lama Sanchez	ATOS	ES
Fabrizio	Fallarini	MESAP	IT
Helio	Fernandez Tellez	IMEC	BE
Łukasz	Kulas	Politechnika Gdanska	PL
Eila	Linna	Lapinamk	FI
Bruno	Rouchouze	Thales	FR
Marija	Trajkovic	TU/e	NL
Carina	Weijma	CARWEI	NL

Leaders
Dimitrios	Serpanos	University of Patras	GR
Enrico	Sangiorgi	University of Bologna	IT
Sven	Rzepka	FhG ENAS	DE
Contributors
Mart	Graef	TU Delft	NL
Jouni	Ahopelto	VTT	FI
Paolo	Azzoni	Eurotech, Inside-IA	IT
Francis	Balestra	IMEP	FR
Sywert	Brongersma	Imec	NL
Daniela	Cancila	CEA	FR
Danilo	Demarchi	Politecnico di Torino	IT
Gianluigi	Ferrari	University of Parma	IT
Luis	Fonseca	IBM-CNM (CSIC)	ES
Péter	Fürjes	MTA EK / MFA	HU
Przemyslaw	Gromala	Bosch	DE
Said	Hamdioui	TU Delft	NL
Adrian	Ionescu	EPFL	CH
Ahmed	Jerraya	CEA	FR
Chris	Merveille	IK4-IKERLAN	ES
George	Nikolakopoulos	Lulea University of Technology	SE
Jon	Perez	IK4-IKERLAN	ES
Ralf	Popp	Edacentrum	DE
Michael	Salter	RISE	SE
Holger	Schmidt	Infineon Technologies AG	DE
Markus	Tauber	FH Burgenland	DE

List of Contributors

CORE TEAM

INTRODUCTION AND OVERVIEW

1 Foundational Technology Layers

CHAPTER 1.1 – PROCESS TECHNOLOGY, EQUIPMENT, MATERIALS AND SEMICONDUCTOR MANUFACTURING

CHAPTER 1.2 – COMPONENTS, MODULES AND SYSTEMS INTEGRATION

CHAPTER 1.3 – EMBEDDED SOFTWARE AND BEYOND

CHAPTER 1.4 – SYSTEM OF SYSTEMS

2 CROSS-SECTIONAL TECHNOLOGIES

CHAPTER 2.1 – EDGE COMPUTING AND EMBEDDED ARTIFICIAL INTELLIGENCE

CHAPTER 2.2 CONNECTIVITY

CHAPTER 2.3 ARCHITECTURE AND DESIGN: METHODS AND TOOLS

CHAPTER 2.3 QUALITY, RELIABILITY, SAFETY AND CYBERSECURITY

3 ECS Key Application Areas

CHAPTER 3.1 MOBILITY

CHAPTER 3.2 ENERGY

CHAPTER 3.3 DIGITAL INDUSTRY

CHAPTER 3.4 HEALTH AND WELLBEING

CHAPTER 3.5 AGRIFOOD AND NATURAL RESOURCES

CHAPTER 3.6 DIGITAL SOCIETY

4 Long Term Vision