| 2D, 3D |
Two dimension(al), three dimension (al) |
| 5G |
Fifth-generation communication network |
| 6G |
Sixth-generation communication network |
| A&P |
Assembly and packaging |
| AAL |
Ambient Assisted Living |
| ACA |
Anisotropic conductive adhesive |
| ACES |
Autonomous, connected, electric and shared |
| ACK |
Alexa Communication Kit |
| ADAS |
Advanced driver-assistance system |
| AF-EAF |
Air Force Enterprise Architecture Framework |
| AFIoT |
Architecture Framework for the Internet of Things |
| AFM |
Atomic force microscopy |
| AI |
Artificial Intelligence |
| AIOTI |
Alliance for the Internet of Things Innovation |
| AIoT |
Artificial Intelligence of things |
| AlN |
Aluminum nitride |
| ALU |
Arithmetic logic unit |
| ANN |
Artificial Neural Network |
| AMD |
Age-related macular degeneration |
| AMS |
Analogue/mixed signal |
| API |
Application programming interface |
| AR |
Augmented reality |
| AS |
Autonomous system |
| ASIC |
Application-specific integrated circuit |
| AUTOSAR |
AUTomotive Open System Architecture |
| B2B |
Business-to-business |
| B2C |
Business-to-consumer |
| BATX |
Baidu, Alibaba, Tencent and Xiaomi |
| BCI |
Brain–computer interface |
| BDVA |
Big Data Value Association |
| BEOL |
Back end of line |
| BEV |
Battery electric vehicle |
| BGA |
Ball grid array |
| BiCMOS |
Bipolar CMOS |
| BIST |
Built-in self-test |
| BOM |
Bill of materials |
| BOX |
Buried oxide |
| C&K |
Competence and knowledge |
| CAD |
Computer-aided design |
| CAFCR |
Customer Objectives, Application, Functional, Conceptual and Realisation Model |
| CAGR |
Compound annual growth rate |
| Cath lab |
Catheterisation laboratory |
| CAV |
Connected autonomous vehicle |
| CB |
Conductive-bridge |
| CBRAM |
Conductive-bridging RAM |
| CCAM |
Connected, Cooperative and Automated Mobility |
| CDR |
Carbon dioxide removal |
| CEAP |
Circular Economy Action Plan |
| CFD |
Computational fluid dynamics |
| CMOS |
Complementary metal–oxide–semiconductor |
| cMUT |
Capacitive micromachined ultrasound transducer |
| CNN |
Convolutional neural network |
| CNT |
Carbon nanotube |
| CPS |
Cyber-physical system |
| CPU |
Central processing unit |
| CrMMC |
Carbon-reinforced metal matrix composites |
| CRM |
Critical Raw Material |
| CT |
Computed tomography |
| CVD |
Chemical vapour deposition |
| D2D |
Device-to-device |
| DCS |
Distributed control systems |
| DfA |
Design for assembly |
| DfM |
Design for manufacturing |
| DfR |
Design for reliability |
| DfX |
Design for excellence |
| DL |
Deep learning |
| DMA |
Direct Memory Access |
| DNN |
Deep neural network |
| DPP |
Digital Product Password |
| DPU |
Data Processing Unit |
| DRAM |
Dynamic random access memory |
| DSA |
Directed self-assembly |
| DSL |
Domain-specific language |
| DSS |
Decision-support system |
| DT |
Drug-targeted |
| DUV |
Deep ultraviolet |
| E/E |
Electrical/electronic |
| EC-RAM |
Error correction RAM |
| ECPS |
Embedded and cyber-physical system |
| ECS |
Electronic components and systems |
| ECSO |
European Cyber Security Organisation |
| ECU |
Electronic control unit |
| EDA |
Electronic design automation |
| EFFRA |
European Factories of the Future Research Association |
| eHPC |
Embedded high-performance computing |
| EHR |
Electronic health record |
| EIP-AGRI |
European Innovation Partnership “Agricultural Productivity and Sustainability” |
| EMC |
Electromagnetic compatibility |
| EMI |
Electromagnetic interference |
| EMR |
Electronic medical record |
| EMS |
Energy management systems |
| eNVM |
Embedded non-volatile memory |
| EOL |
End-of-life |
| EP |
Engineering process |
| EPI |
European Processor Initiative |
| ERP |
Enterprise resource planning |
| ERTRAC |
European Road Transport Research Advisory Council |
| ESAAF |
European Space Agency Architecture Framework |
| ESS |
Electronic smart system |
| ETP |
European Technology Platform |
| ETP4HPC |
European Technology Platform for High Performance Computing |
| EU |
European Union |
| EUV |
Extreme ultraviolet |
| EV |
Electric vehicle |
| FAIR |
Facebook AI Research |
| FAIRness |
Findability, accessibility, interoperability and reuse |
| FCC |
Federal Communications Commission |
| FDSOI |
Fully depleted SOI |
| Fe |
Ferroelectric |
| FEM |
Finite element method |
| FEOL |
Front end of line |
| FET |
Future and emerging technologies |
| FFT |
Fast Fourier transform |
| FinFet |
Fin field-effect transistor |
| FLOPS |
(flops or flop/s) Floating point operations per second |
| FMEA |
Failure mode and effect analysis |
| FMI |
Functional mock-up interface |
| FMIS |
Farm management information system |
| fMRI |
Functional magnetic resonance imaging |
| FMU |
Functional mock-up unit |
| FPGA |
Field-programmable gate array |
| GAA |
Gate All Around |
| GAFAM |
Google, Apple, Facebook, Amazon and Microsoft |
| GAMAM |
like GAFAM but with the new name of Facebook (Meta) |
| GaN |
Gallium nitride |
| GDPR |
General data protection regulation |
| GHG |
Greenhouse gas |
| GPS |
Global Positioning System |
| GPU |
Graphics processing unit |
| HAD |
Highly automated driving |
| HCI |
Human–computer interaction |
| HEMT |
High-electron-mobility transistor |
| HEV |
Hybrid electric vehicle |
| HF |
High-frequency |
| HIL |
Hardware-in-the-loop |
| HIR |
Heterogeneous Integration Roadmap |
| HMI |
Human–machine interface |
| HMLV |
High mix low volume |
| HPC |
High-performance computing |
| HTA |
Hexagon Tensor Accelerator |
| HVAC |
Heating, ventilation and air conditioning |
| HVDC |
High-voltage direct current |
| HW |
Hardware |
| I/O |
Input/output |
| IC |
Integrated chip |
| IC |
Integrated circuit |
| ICT |
Information and communications technology |
| IDM |
Integrated device manufacturer |
| IEA |
International Energy Agency |
| IGBT |
Insulated-gate bipolar transistor |
| IIA |
Industrial Internet Architecture |
| IIoT |
Industrial IoT |
| IIRA |
Industrial Internet Reference Architecture |
| IMC |
In Memory Computing |
| INCOSE |
International Council on Systems Engineering |
| iNEMI |
International Electronics Manufacturing Initiative |
| IoMT |
Internet of Medical Things |
| IoT |
Internet of Things |
| IP |
Intellectual property |
| IP |
Internet protocol |
| IPCEI |
Important project of common European interest |
| IPM |
Integrated pest management |
| IPSR |
Integrated Photonic Systems Roadmap |
| IR |
Infrared |
| IRDS |
International Roadmap for Devices and Systems |
| ISOC |
Internet Society |
| IT |
information technology |
| IVD |
in vitro diagnostic |
| IXP |
Internet exchange point |
| JU |
Joint undertaking |
| KDT |
Key Digital Technologies |
| KFI |
Key failure indicator |
| KPI |
Key performance indicator |
| LAE |
Large-area electronics |
| LCA |
Lifecycle assessment |
| LCP |
Liquid crystal polymers |
| LCOE |
Levelised cost of electricity |
| LED |
Light Emitting Diode |
| LLM |
Large Language Model |
| LoC |
Lab-on-a-chip |
| LV |
Low voltage |
| M2M |
Machine-to-machine |
| MaaS |
Manufacturing as a service |
| MaaS |
Mobility-as-a-service |
| MCM |
Multi-chip module |
| MCU |
Microcontroller unit |
| MDM |
Multi-dimensional metrology |
| MEC |
Multi-access edge computing |
| MEC |
Mobile edge computing |
| Medtech |
Medical technology |
| MEMS |
Micro-electromechanical systems |
| MES |
Manufacturing execution system |
| MES |
Multi-energy system |
| MIL |
Model-in-the-loop |
| ML |
Machine learning |
| MM-ENS |
Multimodal energy system |
| MNBS |
Micro-nano-bio system |
| MNS |
Micro-nanosystems |
| MODAF |
Ministry of Defence Architecture Framework (UK) |
| MOEMS |
Micro-opto-electro-mechanical system |
| MOF |
Metal–organic framework |
| MOOC |
Massive open online course |
| MOSFET |
Metal–oxide–semiconductor field-effect transistor |
| MPU |
Microprocessing unit |
| MRAM |
Magnetic RAM |
| MUT |
Micromachined ultrasonic transducer |
| MV |
Medium voltage |
| NB |
Narrowband |
| NEMS |
Nano-electromechanical systems |
| NFV |
Network functions virtualisation |
| NFVI |
Network functions virtualisation infrastructure |
| NLU |
Natural language understanding |
| NMC |
Near Memory Computing |
| NoC |
Network on Chip |
| NPU |
Neuromorphic processing unit |
| NVM |
Non-volatile memory |
| OCT |
Optical coherence tomography |
| ODD |
Operational design domain |
| OECD |
Organisation for Economic Co-operation and Development |
| OEF |
Organisation Environmental Footprint |
| OEM |
Original equipment manufacturer |
| OLED |
Organic LED |
| OOC |
Organ-on-a-chip |
| OPV |
Organic Photovoltaics |
| OSI |
open systems interconnection |
| OSS |
Operations support system |
| OT |
Operational technology |
| OTA |
Over-the-air |
| OXRAM |
Oxide-based RAM |
| P2P |
Peer-to-peer |
| P4 |
Predictive, preventive, personalised, participatory |
| PAD |
Productivity-aware design |
| PCB |
Printed circuit board |
| PCM |
Phase-change memory |
| PCRAM |
Phase-change RAM |
| PDMS |
Polydimethylsiloxane |
| PEALD |
Plasma-enhanced atomic layer deposition |
| PEF |
Product Environmental Footprint |
| PFAS |
Per- and Polyfluorinated Substances |
| PFI |
Physical and functional integration |
| PGHD |
Patient-generated health data |
| PHM |
Prognostic health management |
| Pl |
Polyimide |
| PIII |
Plasma-immersion ion implantation |
| PIC |
Photonic Integrated Circuit |
| PLC |
Programmable logic controllers |
| PLM |
Product lifestyle management |
| PMIC |
Power management integrated circuit |
| PMUT |
Piezoelectric micromachined ultrasound transducer |
| PoC |
Point-of-care |
| PoCT |
Point-of-care testing |
| PoF |
Physics of failure |
| PPAC |
Power, performance, area and cost |
| PPE |
Personal protective equipment |
| ppm |
Parts per million |
| PPP |
Public/private partnership |
| PSiP |
Power source in a package |
| PTEMM |
Process technologies, equipment, materials and manufacturing |
| PV |
Photovoltaics |
| PVD |
Physical vapour deposition |
| PwrSiP |
Power system in a package |
| PwrSoC |
Power source on a chip |
| PZT |
Lead zirconate titanate |
| QIP |
Quantum information processing |
| QoS |
Quality of service |
| QRSC |
Quality, reliability, safety and cybersecurity |
| Qubit |
Quantum bit |
| qZSI |
Quasi-impedence source inverter |
| R&D |
Research and development |
| R&D&I |
Research and development and innovation |
| RAM |
Random-access memory |
| RAMI 4.0 |
Reference Architecture Model for Industry 4.0 |
| ReRAM |
Resistive RAM |
| RES |
Renewable energy system |
| RF |
Radio frequency |
| RFID |
Radio-frequency identification |
| RL |
Reinforcement learning |
| RNN |
Recursive neural network |
| ROHS |
Restriction of Hazardous Substances Directive |
| ROI |
Return on investment |
| RPA |
Robotic process automation |
| RRAM |
Resistive RAM |
| RT-PCR |
Real-time reverse transcription polymerase chain reaction |
| RTE |
Run-time environment |
| RTO |
Research and technology organisation |
| RUL |
Remaining useful life |
| SaaS |
Software as a service |
| SAC |
Conventional SnAgCu |
| SAC |
Tin-silver-copper alloy (SnAgCu) |
| SAE |
Society of Automotive Engineers |
| SCADA |
Supervisory control and data acquisition |
| ScAIN |
Scandium aluminium nitride |
| SCM |
Storage class memory |
| SCM |
Supply chain management |
| SDDS |
Smart drug delivery system |
| SDG |
Sustainable Development Goal |
| SDK |
Software development kit |
| SDN |
Software-defined networking |
| SDR |
Software-defined radio |
| SEAP |
Strategic Environmental Assessment Plan |
| SECAP |
Sustainable Energy and Climate Action Plan |
| SEES |
Self-powered electrochemical energy storage system |
| SGD |
Speech-generating device |
| SiC |
Silicon carbide |
| SIL |
Software-in-the-loop |
| SiP |
System in a package |
| SKC |
Skills, knowledge and competence |
| SME |
Small and medium-sized enterprise |
| SNN |
Spiking Neural Network |
| SoA |
Service-oriented architecture |
| SoC |
System on a chip |
| SoCPS |
System of cyber-physical systems |
| SOI |
Silicon-on-insulator |
| SoS |
System of Systems |
| SOT |
Spin-orbit torque |
| SOTIF |
Safety of Intended Functionality |
| SPIRE |
Sustainable Process Industry through Resource and Energy Efficiency |
| SRAM |
Static RAM |
| SRGM |
Software reliability growth models |
| SRIA |
Strategic Research and Innovation Agenda |
| SSI |
Smart systems integration |
| STDP |
Spike-timing-dependent plasticity |
| STEM |
Science, technology, engineering and mathematics |
| STS |
Socio-technical system |
| STT |
Spin-transfer torque |
| SUMP |
Sustainable Urban Mobility Plan |
| SUT |
System-under-test |
| SW |
Software |
| SWM |
Smart Water Management |
| TCP |
Transmission control protocol |
| TEV |
Through-encapsulant via |
| TOPS |
Tera operations per second |
| TOU |
Time of use |
| TPU |
Tensor processing unit |
| TPU |
Thermoplastic Polyurethane |
| TRL |
Technology readiness level |
| TSMC |
Taiwan Semiconductor Manufacturing Company |
| TSN |
Time-sensitive network |
| TSO |
Transmission system operator |
| TSV |
Through-silicon via |
| TV&V |
Testing validation and verification |
| UAV |
Unmanned aerial vehicle |
| UAV |
Unmanned autonomous vessel |
| ULP |
Ultra-low power |
| UN |
United Nations |
| UPS |
Uninterruptible power supply |
| UXV |
Unmanned vehicle |
| V&V |
Verification & validation |
| V2G |
Vehicle to grid |
| V2X |
Vehicle-to-everything |
| VCMA |
Voltage-controlled magnetic anisotropy |
| VIL |
Vehicle-in-the-loop |
| VLSI |
Very large-scale integration |
| VOC |
Volatile organic compound |
| VR |
Virtual reality |
| WBG |
Wide bandgap |
| WHO |
World Health Organization |
| WLP |
Wafer-level packaging |
| WLTP |
Worldwide Harmonised Light Vehicle Test Procedure |
| XR |
Extended reality |
