| 5G | Fifth-generation communication network |
| 6G | Sixth-generation communication network |
| A&P | Assembly and packaging |
| AAL | Ambient Assisted Living |
| ACA | Anisotropic conductive adhesive |
| ACES | Autonomous, connected, electric and shared |
| ACK | Alexa Communication Kit |
| ADAS | Advanced driver-assistance system |
| AEB | Automated Emergency Braking |
| AF-EAF | Air Force Enterprise Architecture Framework |
| AFIoT | Architecture Framework for the Internet of Things |
| AFM | Atomic force microscopy |
| AI | Artificial Intelligence |
| AIOTI | Alliance for the Internet of Things Innovation |
| AIoT | Artificial Intelligence of things |
| ALD | Atomic layer deposition |
| AlN | Aluminum nitride |
| ALU | Arithmetic logic unit |
| ANN | Artificial Neural Network |
| AMD | Age-related macular degeneration |
| AMS | Analogue/mixed signal |
| ANC | Active noise cancellation |
| API | Application programming interface |
| AR | Augmented reality |
| AS | Autonomous system |
| ASIC | Application-specific integrated circuit |
| ATE | Automated test equipment |
| AUTOSAR | AUTomotive Open System Architecture |
| B2B | Business-to-business |
| B2C | Business-to-consumer |
| BATX | Baidu, Alibaba, Tencent and Xiaomi |
| BCD | Bipolar CMOS DMOS |
| BCI | Brain–computer interface |
| BDVA | Big Data Value Association |
| BEOL | Back end of line |
| BESS | Battery Energy Storage System |
| BEV | Battery electric vehicle |
| BGA | Ball grid array |
| BiCMOS | Bipolar CMOS |
| BIST | Built-in self-test |
| BOM | Bill of materials |
| BOX | Buried oxide |
| C&K | Competence and knowledge |
| CAD | Computer-aided design |
| CAFCR | Customer Objectives, Application, Functional, Conceptual and Realisation Model |
| CAGR | Compound annual growth rate |
| Cath lab | Catheterisation laboratory |
| CAV | Connected autonomous vehicle |
| CB | Conductive-bridge |
| CBRAM | Conductive-bridging RAM |
| CCAM | Connected, Cooperative and Automated Mobility |
| CDR | Carbon dioxide removal |
| CEAP | Circular Economy Action Plan |
| CFD | Computational fluid dynamics |
| CFET | Complementary Field Effect Transistor |
| CIS | CMOS Image Sensors |
| CMOS | Complementary metal–oxide–semiconductor |
| CMS | Components, Modules and Systems |
| cMUT | Capacitive micromachined ultrasound transducer |
| CNN | Convolutional neural network |
| CNT | Carbon nanotube |
| CPS | Cyber-physical system |
| CPU | Central processing unit |
| CrMMC | Carbon-reinforced metal matrix composites |
| CRM | Critical Raw Material |
| CSA | Climate Smart Agriculture |
| CT | Computed tomography |
| CVD | Chemical vapour deposition |
| D2D | Device-to-device |
| D2W | Die to wafer |
| DCS | Distributed control systems |
| DfA | Design for assembly |
| DfM | Design for manufacturing |
| DfR | Design for reliability |
| DfX | Design for excellence |
| DL | Deep learning |
| DMA | Direct Memory Access |
| DNN | Deep neural network |
| DPP | Digital Product Password |
| DPU | Data Processing Unit |
| DRAM | Dynamic random access memory |
| DSA | Directed self-assembly |
| DSL | Domain-specific language |
| DSS | Decision-support system |
| DT | Drug-targeted |
| DUV | Deep ultraviolet |
| E/E | Electrical/electronic |
| EC-RAM | Electrochemical RAM |
| ECPS | Embedded and cyber-physical system |
| ECS | Electronic components and systems |
| ECSO | European Cyber Security Organisation |
| ECU | Electronic control unit |
| EDA | Electronic design automation |
| EFFRA | European Factories of the Future Research Association |
| eHPC | Embedded high-performance computing |
| EHR | Electronic health record |
| EIP-AGRI | European Innovation Partnership “Agricultural Productivity and Sustainability” |
| EMC | Electromagnetic compatibility |
| EMI | Electromagnetic interference |
| EMR | Electronic medical record |
| EMS | Energy management systems |
| eNVM | Embedded non-volatile memory |
| EOL | End-of-life |
| EP | Engineering process |
| EPD | Environmental product declaration |
| EPI | European Processor Initiative |
| EPLCA | European Platform on Life Cycle Assessment |
| ERP | Enterprise resource planning |
| ERTRAC | European Road Transport Research Advisory Council |
| ESAAF | European Space Agency Architecture Framework |
| ESS | Electronic smart system |
| ETP | European Technology Platform |
| ETP4HPC | European Technology Platform for High Performance Computing |
| EU | European Union |
| EUV | Extreme ultraviolet |
| EV | Electric vehicle |
| FAIR | Facebook AI Research |
| FAIRness | Findability, accessibility, interoperability and reuse |
| FCC | Federal Communications Commission |
| FDSOI | Fully depleted SOI |
| FeFET | Ferroelectric Field Effect Transistor |
| FEM | Finite element method |
| FEOL | Front end of line |
| FET | (depending on the context) Field Effect Transistor or Future and emerging technologies |
| FFT | Fast Fourier transform |
| FinFET | Fin field-effect transistor |
| FLOPS | (flops or flop/s) Floating point operations per second |
| FMEA | Failure mode and effect analysis |
| FMI | Functional mock-up interface |
| FMIS | Farm management information system |
| fMRI | Functional magnetic resonance imaging |
| FMU | Functional mock-up unit |
| FPGA | Field-programmable gate array |
| FTJ | Ferroelectric tunnel junction |
| GAA | Gate All Around |
| GAFAM | Google, Apple, Facebook, Amazon and Microsoft |
| GAMAM | like GAFAM but with the new name of Facebook (Meta) |
| GaAs | Gallium Arsenide |
| GaN | Gallium Nitride |
| GDP | Gross Domestic Product |
| GDPR | General data protection regulation |
| GHG | Greenhouse gas |
| GPS | Global Positioning System |
| GPU | Graphics processing unit |
| GWP | Global warning potential |
| HAD | Highly automated driving |
| HBM | High bandwidth memory |
| HCI | Human–computer interaction |
| HEMT | High-electron-mobility transistor |
| HEV | Hybrid electric vehicle |
| HF | High-frequency |
| HFC | Hydrofluorocarbons |
| HIL | Hardware-in-the-loop |
| HIR | Heterogeneous Integration Roadmap |
| HMI | Human–machine interface |
| HMLV | High mix low volume |
| HPC | High-performance computing |
| HSI | Human-Systems Integration |
| HTA | Hexagon Tensor Accelerator |
| HTF | Heat transfer fluid |
| HVAC | Heating, ventilation and air conditioning |
| HVDC | High-voltage direct current |
| HW | Hardware |
| I/O | Input/output |
| I4.0 | Industry 4.0 |
| | |
| IC | Integrated circuit |
| ICT | (depending on the context) In-circuit test or Information and communications technology |
| IDM | Integrated device manufacturer |
| IEA | International Energy Agency |
| IGBT | Insulated-gate bipolar transistor |
| IIA | Industrial Internet Architecture |
| IIoT | Industrial IoT |
| IIRA | Industrial Internet Reference Architecture |
| IMC | In Memory Computing |
| INCOSE | International Council on Systems Engineering |
| iNEMI | International Electronics Manufacturing Initiative |
| InGaAs | Indium Gallium Arsenide |
| InP | Indium Phosphide |
| IoMT | Internet of Medical Things |
| IoT | Internet of Things |
| IP | Intellectual property |
| IP | Internet protocol |
| IPCEI | Important project of common European interest |
| IPM | Integrated pest management |
| IPSR | Integrated Photonic Systems Roadmap |
| IR | Infrared |
| IRDS | International Roadmap for Devices and Systems |
| ISOC | Internet Society |
| IT | information technology |
| IVD | in vitro diagnostic |
| IXP | Internet exchange point |
| JU | Joint undertaking |
| KDT | Key Digital Technologies |
| KFI | Key failure indicator |
| KPI | Key performance indicator |
| LAE | Large-area electronics |
| LCA | Lifecycle assessment |
| LCP | Liquid crystal polymers |
| LCOE | Levelised cost of electricity |
| LDS | Laser direct structuring |
| LED | Light Emitting Diode |
| LLM | Large Language Model |
| LoC | Lab-on-a-chip |
| LV | Low voltage |
| M2M | Machine-to-machine |
| MaaS | Manufacturing as a service |
| MaaS | Mobility-as-a-service |
| MCM | Multi-chip module |
| MCU | Microcontroller unit |
| MDM | Multi-dimensional metrology |
| MEC | Multi-access edge computing |
| MEC | Mobile edge computing |
| Medtech | Medical technology |
| MEMS | Micro-electromechanical systems |
| MES | Manufacturing execution system |
| MES | Multi-energy system |
| MIL | Model-in-the-loop |
| ML | Machine learning |
| MM-ENS | Multimodal energy system |
| MNBS | Micro-nano-bio system |
| MNS | Micro-nanosystems |
| MODAF | Ministry of Defence Architecture Framework (UK) |
| MOEMS | Micro-opto-electro-mechanical system |
| MOF | Metal–organic framework |
| MOOC | Massive open online course |
| MOSFET | Metal–oxide–semiconductor field-effect transistor |
| MPU | Microprocessing unit |
| MR | Mixed reality |
| MRAM | Magnetic RAM |
| MUT | Micromachined ultrasonic transducer |
| MV | Medium voltage |
| NB | Narrowband |
| NEMS | Nano-electromechanical systems |
| NFV | Network functions virtualisation |
| NFVI | Network functions virtualisation infrastructure |
| NLP | Natural language processing |
| NLU | Natural language understanding |
| NMC | Near Memory Computing |
| NoC | Network on Chip |
| NPU | Neuromorphic processing unit |
| NTN | Non-terrestrial networks |
| NV | Nitrogen vacancies (in diamond) |
| NVM | Non-volatile memory |
| OCT | Optical coherence tomography |
| ODD | Operational design domain |
| OECD | Organisation for Economic Co-operation and Development |
| OEF | Organisation Environmental Footprint |
| OEM | Original equipment manufacturer |
| OLED | Organic LED |
| OOC | Organ-on-a-chip |
| OPV | Organic Photovoltaics |
| OSC | Oxide semiconductor channel |
| OSI | open systems interconnection |
| OSS | Operations support system |
| OT | Operational technology |
| OTA | Over-the-air |
| OxRAM | Oxide-based RAM |
| P2P | Peer-to-peer |
| P4 | Predictive, preventive, personalised, participatory |
| PAD | Productivity-aware design |
| PCB | Printed circuit board |
| PCM | Phase-change memory |
| PCRAM | Phase-change RAM |
| PCT | Product category rules |
| PDMS | Polydimethylsiloxane |
| PEALD | Plasma-enhanced atomic layer deposition |
| PEBB | Power electronics building blocks |
| PEF | Product Environmental Footprint |
| PFAS | Per- and Polyfluorinated Substances |
| PFC | Perfluorocarbons |
| PFI | Physical and functional integration |
| PGHD | Patient-generated health data |
| PHM | Prognostic health management |
| Pl | Polyimide |
| PIII | Plasma-immersion ion implantation |
| PIC | Photonic Integrated Circuit |
| PLC | Programmable logic controllers |
| PLM | Product lifestyle management |
| PMIC | Power management integrated circuit |
| PMUT | Piezoelectric micromachined ultrasound transducer |
| PNN | Photonic neural network |
| PoC | Point-of-care |
| PoCT | Point-of-care testing |
| PoF | Physics of failure |
| PPAC | Power, performance, area and cost |
| PPE | Personal protective equipment |
| ppm | Parts per million |
| PPP | Public/private partnership |
| PSiP | Power supply in package |
| PTEMM | Process technologies, equipment, materials and manufacturing |
| PV | Photovoltaics |
| PVD | Physical vapour deposition |
| PwrSoC | Power supply on chip |
| PZT | Lead zirconate titanate |
| QIP | Quantum information processing |
| QKD | Quantum key distribution |
| QoS | Quality of service |
| QRSC | Quality, reliability, safety and cybersecurity |
| Qubit | Quantum bit |
| qZSI | Quasi-impedence source inverter |
| R&D | Research and development |
| R&D&I | Research and development and innovation |
| RAG | Retrieval augmented generation |
| RAM | Random-access memory |
| RAMI 4.0 | Reference Architecture Model for Industry 4.0 |
| ReRAM | Resistive RAM |
| RES | Renewable energy system |
| RF | Radio frequency |
| RFID | Radio-frequency identification |
| RL | Reinforcement learning |
| RNN | Recursive neural network |
| ROHS | Restriction of Hazardous Substances Directive |
| ROI | Return on investment |
| RPA | Robotic process automation |
| RRAM | Resistive RAM |
| RT-PCR | Real-time reverse transcription polymerase chain reaction |
| RTE | Run-time environment |
| RTO | Research and technology organisation |
| RUL | Remaining useful life |
| SaaS | Software as a service |
| SAC | Tin-silver-copper alloy (SnAgCu) |
| SAE | Society of Automotive Engineers |
| SCADA | Supervisory control and data acquisition |
| ScAIN | Scandium aluminium nitride |
| SCM | Storage class memory |
| SCM | Supply chain management |
| SDDS | Smart drug delivery system |
| SDG | Sustainable Development Goal |
| SDK | Software development kit |
| SDN | Software-defined networking |
| SDR | Software-defined radio |
| SEAP | Strategic Environmental Assessment Plan |
| SECAP | Sustainable Energy and Climate Action Plan |
| SEES | Self-powered electrochemical energy storage system |
| SGD | Speech-generating device |
| SiC | Silicon carbide |
| SiGe | Silicon Germanium (alloy) |
| SIL | Software-in-the-loop |
| SiN | Silicon Nitride |
| SiP | System in a package |
| SKC | Skills, knowledge and competence |
| SME | Small and medium-sized enterprise |
| SNN | Spiking Neural Network |
| SoA | Service-oriented architecture |
| SoC | System on a chip |
| SoCPS | System of cyber-physical systems |
| SOI | Silicon-on-insulator |
| SoS | System of Systems |
| SOT | Spin-orbit torque |
| SOTIF | Safety of Intended Functionality |
| SPIRE | Sustainable Process Industry through Resource and Energy Efficiency |
| SQUID | Superconducting quantum interference device |
| SRAM | Static RAM |
| SRGM | Software reliability growth models |
| SRIA | Strategic Research and Innovation Agenda |
| SSI | Smart systems integration |
| STDP | Spike-timing-dependent plasticity |
| STEM | Science, technology, engineering and mathematics |
| STS | Socio-technical system |
| STT | Spin-transfer torque |
| SUMP | Sustainable Urban Mobility Plan |
| SUT | System-under-test |
| SW | Software |
| SWM | Smart Water Management |
| TCM | Threshold change memory |
| TCP | Transmission control protocol |
| TEV | Through-encapsulant via |
| TOPS | Tera operations per second |
| TOU | Time of use |
| TPU | Tensor processing unit |
| TPU | Thermoplastic Polyurethane |
| TRL | Technology readiness level |
| TSMC | Taiwan Semiconductor Manufacturing Company |
| TSN | Time-sensitive network |
| TSO | Transmission system operator |
| TSV | Through-silicon via |
| TV&V | Testing validation and verification |
| UAV | Unmanned aerial vehicle |
| UAV | Unmanned autonomous vessel |
| ULP | Ultra-low power |
| UN | United Nations |
| UPS | Uninterruptible power supply |
| UWB | Ultra-Wide Band |
| UWBG | Ultra-Wide bandgap |
| UXV | Unmanned vehicle |
| V&V | Verification & validation |
| V2G | Vehicle to grid |
| V2X | Vehicle-to-everything |
| VCMA | Voltage-controlled magnetic anisotropy |
| VIL | Vehicle-in-the-loop |
| VIS-NIR | Visible – Near infrared |
| VLSI | Very large-scale integration |
| VOC | Volatile organic compound |
| VR | Virtual reality |
| W2W | Wafer to wafer |
| WBG | Wide bandgap |
| WHO | World Health Organization |
| WLP | Wafer-level packaging |
| WLTP | Worldwide Harmonised Light Vehicle Test Procedure |
| WSN | Wireless sensors network |
| XR | Extended reality |
