Contributors | ECS SRIA

Updated 2024-11-28

Chairman
Patrick	Cogez	AENEAS Office	FR
Vice-Chairs
Matthias	Künzel	EPoSS Office	DE
Paolo	Azzoni	EuroTech, Inside-IA	IT
Core Team
Christophe	Wyon	CEA	FR
Wolfgang	Dettmann	Infineon	DE
Jurgen	Niehaus	SafeTRANS	DE
Jerker	Delsing	Lulea University of Technology	SE
Patrick	Pype	NXP	BE
Sven	Rzepka	Fraunhofer ENAS	DE
Arco	Krijgsman	ASML	NL

Leaders
Paolo	Azzoni	Eurotech, Inside-IA	IT
Patrick	Cogez	AENEAS Office	FR
Nicolas	Gouze	EPoSS Office	DE
Christophe	Wyon	CEA	FR
Wolfgang	Dettmann	Infineon	DE
Jurgen	Niehaus	SafeTRANS	DE
Jerker	Delsing	Lulea University of Technology	SE
Patrick	Pype	NXP	BE
Sven	Rzepka	Fraunhofer-Gesellschaft	DE
Arco	Krijgsman	ASML	NL

1.1
Process Technology, Equipment, Materials And Manufacturing

Leaders
Valentina	Terzieva	IMEC	BE
Arco	Krijgsman	ASML	NL
Christian	Rüster	Carl Zeiss	DE
Christophe	Wyon	CEA	FR
Dominique	Thomas	STMicroelectronics	FR
Christophe	Figuet	Soitec	FR
Christian	Meyne	Infineon	DE
Contributors
Mohand	Achouche	Nokia	FR
Ton	Backx	Technical University of Eindhoven	NL
Roel	Baets	University of Gent	BE
Livio	Baldi	ENI2	IT
Francis	Balestra	IMEP	FR
Markus	Bender	Advanced Mask Technology Center	DE
Jérôme	Bourderionnet	Thales Research and Technology	FR
François	Brunier	SOITEC	FR
Wolfgang	Buchholtz	GlobalFoundries	DE
Heinz	Cramer	LAM Research - AU	AU
Robin	de Bruijn	Philips Innovation Services	NL
Frank	de Jong	FEI	NL
Stefan	de Gendt	IMEC	BE
Wolfgang	Dettmann	Infineon	DE
Gerhard	Domann	Fraunhofer ISC	DE
Marc	Duranton	CEA	FR
Ilan	Englard	Applied Materials	NL
Thomas	Fleischmann	Bosch	DE
Luis	Fonseca	IMB-CNM (CSIC)	ES
Mart	Graef	TU Delft	NL
Soenke	Habenicht	Nexperia	DE
Paul	Heremans	Imec	BE
Michael	Heuken	AIXTRON	DE
Olaf	Kievit	TNO	NL
Jochen	Kinauer	camLine	DE
Anton	Koeck	Materials Center Leoben	AT
Herman	Leenders	Technical University of Eindhoven	NL
Arne	Leinse	LioniX	NL
Smuel	Mironi	NOVA	IL
Reinhard	Neul	Robert Bosch	DE
George	Nikolakopoulos	Luleå University of Technology	SE
Cian	O'Murchu	Tyndall National Institute	IE
Lothar	Pfitzner	Friedrich-Alexander-Universität	DE
Anneliese	Poenninger	EV Group	AT
Klaus	Pressel	Infineon	DE
Pekka	Pursula	VTT	FI
Carlo	Reita	CEA	FR
Kari	Ronka	Flexbright	FI
Laurent	Roux	Ion Beam Services	FR
Martin	Schellenberger	Fraunhofer IISB	DE
Michael	Scholles	Fraunhofer IPMS	DE
Robert	Schreutelkamp	Applied Materials	BE
Georg	Schwalb	Siltronic	DE
Pietro	Siciliano	IMM-CNR	IT
Hessel	Sprey	ASM	BE
Anne	Van den Bosch	IMEC	BE
Rogier	Verberk	TNO	NL
Andre	Verweij	BESI	NL
Philippe	Vialletelle	STMicroelectronics	FR
Marco	Gavagnin	AT&S	AT
Sven	Rzepka	Fraunhofer ENAS	DE

1.2
Components, Modules and Systems Integration

Leaders
Matthias	Kühnel	Robert Bosch GmbH	DE
Luis	Fonseca	IMB-CNM (CSIC)	ES
Erika	Györvary	CSEM	CH
Michael	Scholles	Fraunhofer IPMS	DE
Karl-Friedrich	Becker	Fraunhofer IZM	DE
Michael	Hayes	Tyndall	IE
Przemyslaw Jakub	Gromala	Robert Bosch GmbH	DE
Contributors
Achim	Bittner	Hahn-Schickard	DE
Martin	Strassburg	AMS Osram	AU
Torsten	Grawunder	Swissbit	CH
Valentina	Terzieva	IMEC	BE
Vishal	Jagtap	MCCI	IR
Patrick	Abraham	Lynred	FR
Wolfgang	Dettmann	Infineon	DE
Matthias	Künzel	VDI/VDE	DE
Pekka	Pursula	VTT Technical Research Centre of Finland, Ltd.	FI
Sven	Rzepka	Fraunhofer ENAS	DE
Renauld	de Langlade	Novapack Technologies	FR
Kai	Kriegel	Siemens AG	DE
Peter	Ramm	Fraunhofer EMFT	DE
Sven	Spieth	Hahn-Schickard	DE
Sanae	Boulay	NXP Semiconductors	NL
Patrick	Pype	NXP Semiconductors	NL
Michael	Paulweber	AVL List GmbH	AU
Michael	Cernusca	AMS Osram	AU
Pauli	Kuosmanen	Tampere University	FI
Paolo	Azzoni	Eurotech, Inside-IA	IT
Reinhard	Neul	Robert Bosch GmbH	DE
Alberto	Sillitti	Centre for Applied Software Engineering	IT
Marco	Cavagnin	AT&S AG	AT
Maik	Wiemer	Fraunhofer ENAS	DE
Frank	Roscher	Fraunhofer ENAS	DE
Timo	Aalto	VTT Technical Research Centre of Finland, Ltd.	FI
Jukka	Hast	VTT Technical Research Centre of Finland, Ltd.	FI
Manfred	Dietrich	Dikuli	DE

1.3
Embedded Software and Beyond

Leaders
Ronald	Begeer	TNO	NL
Paolo	Azzoni	EuroTech, Inside-IA	IT
Peter	Priller	AVL	AT
Jasmin	Jahić	University of Cambridge	UK
Contributors
Paolo	Azzoni	Eurotech, Inside-IA	IT
Frans	Beenker	TNO	NL
Gael	Blondelle	Eclipse	FR
Jerker	Delsing	Lulea University of Technology	SE
Willibald	Krenn	Silicon Austria Labs	AT
Marc	Duranton	CEA	FR
Luis Lino	Ferreira	ISEP	PT
Joost	Gabriels	Eindhoven University of Technology	NL
Lenka	Koskova	TUL	CZ
Philippe	Krief	Eclipse	DE
Patrick	Pype	NXP NL	NL
Stefan	Schalk	Philips	NL
Jurgen	Niehaus	SafeTRANS	DE
Antti	Niemela	Lapimnamk	FI
Olov	Schelen	OPERAX	SE
Davide	Schiavone	Openhwgroup	IT
Marco	Jahn	Eclipse	DE
Daniela	Cancila	CEA	FR
Carlo	Cavazzoni	Leonardo	IT
Alberto	Bianchi	Leonardo	IT

1.4
System of Systems

Leaders
Paolo	Azzoni	Eurotech, Inside-IA	IT
Jerker	Delsing	Lulea University of Technology	SE
Contributors
Ronald	Begeer	TNO	NL
Armando	Colombo	University of Applied Sciences Emden/Leer	DE
Harm	Munk	TNO	NL
Marina	Settembre	Fondazione Ugo Bordoni	IT
Leibbrandt	Wouter	TNO	NL
Stefan	Jakubek	TU Wien	AT
Christoph	Hametner	TU Wien	AT
Gianluigi	Ferrari	University of Parma	IT
Alberto	Bianchi	Leonardo	IT
David	Hästbacka	Tampere University	FI
Jan	van Deventer	Lulea University of Technology	SE
Marke	Tatara	DAC	PL
Per	Olofsson	Sinetiq	SE
Pal	Varga	Budapest University of Technology and Economics	HU
Charles	Robinson	Thales	NL

2.1
Edge Computing and Embedded Artificial Intelligence

Leaders
Marc	Duranton	CEA	FR
Sebastian	Vogel	NXP	DE
Ferdinand	Bell	NXP	DE
Pascal	Ribot	STMicroelectronics	FR
Holger	Schmidt	Infineon	DE
Kay	Bierzynski	Infineon	DE
Paolo	Azzoni	Eurotech, Inside-IA	IT
Contributors
Martin	Cech	University of West Bohemia	CZ
Francesco	Conti	Università di Bologna	IT
Bjorn	Debaillie	IMEC	BE
Mario	Diaz Nava	STMicroelectronics	FR
Stefan	Jakubek	Tu Wien	AT
Nicolas	Lehment	NXP	DE
Dirk	Mayer	Fraunhofer IIS	DE
Francesco	Pessolano	Astrape Networks	IT
Inessa	Seifert	Vdi/Vde	DE
Gerd	Teepe	T3 Technologies	DE
Massimo	Vecchio	FBK	IT
Ovidiu	Vermesan	Sintef	NO

2.2
Connectivity

Leaders
Jerker	Delsing	Lulea University of Technology	SE
Frédéric	Gianesello	STMicroelectronics	FR
Didier	Belot	STMicroelectronics	FR
Contributors
Alexandros	Kaloxylos	6G Industry Association	GR
Christophe	Figuet	SOITEC	FR
Fredrik	Tillman	Ericsson	SE
Piet	Wambacq	IMEC	BE
Mohand	Achouche	Nokia	FR
Timo	Tenhovuori	Nokia	FI
Aarno	Pärsinen	Oulu University	FI
Yaning	Zou	TU Dresden	DE

2.3
Achitecture and Design: Method And Tools

Leaders
Albrecht	Donat	Siemens	DE
Jürgen	Niehaus	SafeTRANS	DE
Horst	Pfluegl	AVL	AT
Ralf	Popp	edacentrum	DE
Contributors
Livio	Baldi	--	IT
Daniela	Cancila	CEA	FR
Manfred	Dietrich	DiKuLi	DE
Fahad	Golra	Agileo Automation	FR
Arco	Kriejgsman	ASML	NL
Eike	Moehlmann	OFFIS	DE
Holger	Schmidt	Infineon	DE

2.4
Quality, Reliability, Safety and Cyber-Security

Leaders
Sven	Rzepka	Fraunhofer ENAS	DE
Michael	Karner	Virtual Vehicle Research GmbH	AT
Daniela	Cancila	CEA	FR
Peter	Moertl	Virtual Vehicle Research GmbH	AT
Luigi	Montinaro	Leonardo	IT

3.1
Mobility

Leaders
Jochen	Langheim	Independent	FR
Gereon	Meyer	VDI / VDE	DE
Michael	Paulweber	AVL List GmbH	AT
Patrick	Pype	NXP Semiconductors	BE
Daniel	Watzenig	VIF	AT
Contributors
Patrick	Abraham	Lynred	FR
Nicola	Amati	POLITECNO DI TORINO	IT
Remi	Bastien	Renault	FR
Cathy	Battison	Renault-Ampere	FR
Lucie	Beaumel	EGVIA	BE
Thilo	Bein	Fraunhofer LBF	DE
Jean-Luc	Brossard	PFA	FR
Andreas	Bugar	Continental	DE
Maria	Caiazza	VDA	DE
Daniela	Cancila	CEA List	FR
Fredrik	Dahlgren	Ericsson	SE
Oliver	Denninger	FZI Forschungszentrum Informatik	DE
Wolfgang	Dettmann	Infineon	DE
Mario	Driussi	VIF	AT
Andreas	Eckel	TTTech	AT
Francois	Fischer	ERTICO	BE
Thomas	Fleischmann	Robert Bosch	DE
Maria	Gemou	Hellenic Institute of Transport	GR
Ole	Grossmann	VDE/VDI-IT	DE
Berthold	Hellenthal	Audi	DE
Arnaud	Jaffuel	Faurecia	FR
Oliver	Jesorsky	Elektrobit	DE
Reiner	John	AVL List GmbH	DE
Alexandru	Kampmann	RWTH Aachen	DE
Jan	Kubovy	BMW	DE
Matthias	Kuehnel	Robert Bosch	DE
Cyril	Lauri	Forvia	FR
Markus	Lienkamp	TU Munich	DE
Magnus	Liljeqvist	Volvo Truck	SE
Prasant	Narula	APTIV	DE
Patrick	Nebout	Faurecia	FR
Jurgen	Niehaus	SafeTRANS e.V.	DE
Markus	Pistauer	CISC	AT
Matthias	Rudolph	TTAuto	DE
Sven	Rzepka	Fraunhofer ENAS	DE
Martin	Schleicher	Continental	DE

3.2
Energy

Leaders
Wolfgang	Dettmann	Infineon	DE
Antonio	Imbruglia	STMicroelectronics	IT
Thomas	Hammer	Siemens AG	DE
Contributors
Michele	Albano	Aalborg University	DK
Angelo	Bonfitto	Politecnico di Torino	IT
Luis	Fonseca	CNM CSIC	ES
Francesco	Gennaro	STMicroelectronics	IT
Romain	Gwoziecki	CEA LETI	FR
Christina	Hirschl	Silicon Austria Labs	AT
Xavier	Jordà	CNM CSIC	ES
Cox	Mark	TU Eindhoven	NL
Trajkovic	Marija	TU Eindhoven	NL
Sergio	Martinez-Navas	LEITAT	ES
Michael	Ostling	KTH	SE
Harald	Pötter	Fraunhofer IZM	DE
Ville	Rauhala	Lapinamk	FI
Thomas	Rössler	Infineon	DE
Michael	Salter	RISE	SE
Johannes	Stöckl	AIT	AT
Andrea	Tonoli	Politecnico di Torino	IT
Pavel	Vaclavek	CEITEC	CZ
Stefan	Wolf	VDI VDE IT	DE

3.3
Digital Industry

Leaders
Alberto	Bianchi	Leonardo S.p.A.	IT
Anna	Ryabokon	Infineon	AT
Antonio	Lionetto	STMicroelectronics	IT
Pauli	Kuosmanen	Tampere University	FI
Mika	Karaila	Valmet Automation	FI

3.4
Health & Wellbeing

Leaders
Olivier	Horbowy	STMicroelectronics	FR
Michael	Scholles	Fraunhofer IPMS	DE
Roger	van Galen	Philips	NL
Contributors
Saurav	Baidya	Philips	NL
Mario	Baum	Fraunhofer ENAS	DE
Ronald	Begeer	TNO	NL
Marc	Desmulliez	School of Engineering & Physical Sciences	UK
Peter	Detemple	Fraunhofer IMM	DE
Wolfgang	Eberle	IMEC	BE
Helio	Fernandez Tellez	IMEC	BE
Cesar	Fernandez-Sanchez	CSIC IMB-CNM	ES
Ignacio	Garcia	Soros Gabinete	ES
Nicolas	Gouze	VDI/ VDE-IT	DE
Piotr	Grabiec	Institute of Electron Technology	PL
Radu	Grosu	TU Wien	AT
Rainer	Günzler	Hahn-Schickard	DE
Christian	Hedayat	Fraunhofer ENAS	DE
Stephan	Karmann	Hahn-Schickard	DE
Lenka	Lhotska	CVUT	CZ
Eila	Linna	Lapinamk	FI
Marc	Masa	LEITAT	ES
Paul	Merkus	TU Eindhoven	NL
Carmen	Moldovan	IMT	RO
Eric	Moore	Tyndall	IE
Sotir	Ouzounov	Philips	NL
Peter	Ramm	Fraunhofer EMFT	DE
Pietro	Siciliano	IMM-CNR	IT
Gerd	Teepe	T3 Technologies	NL
Tatiana	Trantidou	ITML	GR
Maurits	van der Heiden	TNO	NL
Mark	van Helvoort	Philips	NL
Carmen	van Vilsteren	TU Eindhoven	NL
Andrea	Vitaletti	Wsense	IT
Andreas	Vogl	SINTEF	NO
Roberto	Zafalon	STMicroelectronics	IT
Silvia	Zinetti	Inpeco	IT

3.5
Agrifood And Natural Resources

Leaders
Mario	Diaz Nava	STMicroelectronics (Chair)	FR
Cian	Ó Murchú	Tyndall (Co-Chair)	IE
Contributors
Joaquin	Bastos	Instituto de Telecomunicações	PT
Thilo	Bein	Fraunhofer LBF	DE
Jamila	Boudaden	Fraunhofer EMFT	DE
Sywert	Brongersma	Imec-NL	NL
Carles	Cane Ballart	IMB-CNM (CSIC)	ES
Ricardo	Coppel	Hydrao	FR
Danilo	Demarchi	Politecnico di Torino	IT
Roberto	Fresco	CREA	IT
Rafael	Ferrer	Hispatec	ES
Herman	Leenders	TUE	NL
Suzanne	Lesecq	CEA (leti)	FR
Pierre	Lovera	Tyndall	IE
Mike	Morrissey	Analog Devices	IE
Luis	Munoz	Universidad de Cantabria	ES
Louise	Burgoyne	Tyndall	IE
Alan	O'Riordan	Tyndall	IE
Luis	Perez-Freire	Gradiant/AIOTI WG Smart framing	ES
Peter	Ramm	Fraunhofer EMFT	DE
Ricardo	Vazquez Perez	Emalcsa	ES
Ovidiu	Vermesan	Sintef	NO
Gwenaelle	Berthier	IRT-Systemx	FR
Markus	Tauber	RSA FG	AT
Miguel	Roncales	Alphasip	ES

3.6
Digital Society

Leaders
Paul	Merkus	TU/e	NL
Łukasz	Kulas	Politechnika Gdanska	PL
Contributors
Klaas-Jan	Damstra	Grass Valley	NL
Fabrizio	Fallarini	MESAP	IT
Helio	Fernandez Tellez	IMEC	BE
Stephan	Wensveen	TU/e	NL

Leaders
Christophe	Wyon	CEA	FR
Dimitrios	Serpanos	University of Patras	GR
Giorgos	Fagas	Tyndall	IR
Sven	Rzepka	Fraunhofer ENAS	DE
Contributors
Mart	Graef	TU Delft	NL
Enrico	Sangiorgi	University of Bologna	IT
Jouni	Ahopelto	VTT	FI
Paolo	Azzoni	Eurotech, Inside-IA	IT
Francis	Balestra	IMEP	FR
Sywert	Brongersma	Imec	NL
Daniela	Cancila	CEA	FR
Danilo	Demarchi	Politecnico di Torino	IT
Gianluigi	Ferrari	University of Parma	IT
Luis	Fonseca	IBM-CNM (CSIC)	ES
Péter	Fürjes	MTA EK / MFA	HU
Przemyslaw	Gromala	Bosch	DE
Said	Hamdioui	TU Delft	NL
Adrian	Ionescu	EPFL	CH
Ahmed	Jerraya	CEA	FR
Chris	Merveille	GoiEner	ES
George	Nikolakopoulos	Lulea University of Technology	SE
Jon	Perez	IK4-IKERLAN	ES
Ralf	Popp	Edacentrum	DE
Michael	Salter	RISE	SE
Holger	Schmidt	Infineon	DE
Markus	Tauber	RSA FG	AT

List of Contributors ECS SRIA 2025

CORE TEAM

INTRODUCTION AND OVERVIEW

1 Foundational Technology Layers

1.1
Process Technology, Equipment, Materials And Manufacturing

1.2
Components, Modules and Systems Integration

1.3
Embedded Software and Beyond

1.4
System of Systems

2 CROSS-SECTIONAL TECHNOLOGIES

2.1
Edge Computing and Embedded Artificial Intelligence

2.2
Connectivity

2.3
Achitecture and Design: Method And Tools

2.4
Quality, Reliability, Safety and Cyber-Security

3 ECS Key Application Areas

3.1
Mobility

3.2
Energy

3.3
Digital Industry

3.4
Health & Wellbeing

3.5
Agrifood And Natural Resources

3.6
Digital Society

4 Long Term Vision

List of Contributors ECS SRIA 2025

CORE TEAM

INTRODUCTION AND OVERVIEW

1 Foundational Technology Layers

1.1Process Technology, Equipment, Materials And Manufacturing

1.2Components, Modules and Systems Integration

1.3Embedded Software and Beyond

1.4System of Systems

2 CROSS-SECTIONAL TECHNOLOGIES

2.1Edge Computing and Embedded Artificial Intelligence

2.2Connectivity

2.3Achitecture and Design: Method And Tools

2.4Quality, Reliability, Safety and Cyber-Security

3 ECS Key Application Areas

3.1Mobility

3.2Energy

3.3Digital Industry

3.4Health & Wellbeing

3.5Agrifood And Natural Resources

3.6Digital Society

4 Long Term Vision

1.1
Process Technology, Equipment, Materials And Manufacturing

1.2
Components, Modules and Systems Integration

1.3
Embedded Software and Beyond

1.4
System of Systems

2.1
Edge Computing and Embedded Artificial Intelligence

2.2
Connectivity

2.3
Achitecture and Design: Method And Tools

2.4
Quality, Reliability, Safety and Cyber-Security

3.1
Mobility

3.2
Energy

3.3
Digital Industry

3.4
Health & Wellbeing

3.5
Agrifood And Natural Resources

3.6
Digital Society